Arrangement and method for electromagnetic shielding

ABSTRACT

An arrangement for electromagnetic shielding of an electronic component attached to a substrate is described. The arrangement comprises an electrically conductive frame which is attached to the substrate in such a way that the frame frames the component. The arrangement further comprises an electrically conductive covering which is attached at least to a portion of a top side of the component, and which is electrically conductively attached at least to a portion of the frame. Furthermore, a method for electromagnetic shielding of the electronic component attached to the substrate and also a computer program product for carrying out the method are described.

TECHNICAL FIELD

The present disclosure relates generally to the technical field ofelectromagnetic shielding. It relates in particular to an arrangementand to a method for electromagnetic shielding of an electronic componentattached to a substrate.

BACKGROUND

The market for electronic devices is growing continuously. At present,an increased use of electronic devices can be seen especially inmotor-vehicle construction. The electronic devices are in this caseequipped with processor systems having higher and higher clockfrequencies, in order to meet the increasing power requirements of thedevices. The problems of electromagnetic interference (EMI) and theenergy losses in the form of heat also increase, however, with the clockfrequency.

EMI refers to malfunctions of an electronic component of a device causedby the energy in the form of electromagnetic radiation emitted byanother electronic component. In many fields, such as, for example, inmotor vehicles, the malfunctions can lead to safety-critical situations.In order to avoid such malfunctions, the components are separated fromone another by electromagnetic shielding devices.

An electromagnetic shielding is often realised as a device having aplurality of parts. Such a device comprises, for example, a frame, whichlaterally surrounds the component attached to a printed circuit boardacting as substrate, and also a rigid lid, which is attached to theframe and covers the top side of the component facing away from theprinted circuit board.

When attaching the lid to the frame, it should normally be ensured thatthe top side of the component does not project beyond a top side of theframe. In order to reliably preclude a projection of the componentbeyond the top side of the frame despite tolerance-related heightvariations when attaching the component to the printed circuit board(e.g. in the context of a reflow process), a projection of the top sideof the frame beyond the top side of the component is customarilyaccepted in the prior art. Owing to the height difference resultingtherefrom, a gap is formed between the component and the lid of theelectromagnetic shielding device. In order to guarantee sufficientdissipation of the heat emanating from the electronic component, the gapis thermally bridged by a heat-conducting medium (e.g. a heat-conductingpaste).

What goes against the described structure of electronic component,heat-conducting medium and electromagnetic shielding device is therequirement for ever-greater reduction of the overall height of theelectronic devices while increasing the power.

SUMMARY

An improved solution for electromagnetic shielding of an electroniccomponent attached to a substrate is to be provided.

According to a first aspect, an arrangement for electromagneticshielding of an electronic component attached to a substrate isprovided. The arrangement comprises an electrically conductive framewhich is attached to the substrate in such a way that the frame framesthe component. The arrangement further comprises an electricallyconductive covering which is attached at least to a portion of a topside of the component and which is electrically conductively attached atleast to a portion of the frame.

The arrangement can be part of an electronic control unit (ECU). Theelectronic control unit can be provided for installation in a motorvehicle. Other fields of application are also conceivable.

The covering can be attached at least to a portion of a top side of theframe. Additionally or alternatively thereto, the covering can beattached at least to a portion of side faces of the frame. The attachingcan result in the covering being fastened to the frame and to thecomponent.

It can be provided that the covering is flexibly formed. Thus, thecovering can, for example, be bendable. The flexibility can depend on aproperty of the covering (e.g. on a material and on a thickness of thecovering).

The covering can have a thickness of at most 250 μm or at most 100 μm,in particular a thickness of approximately 70 μm. The covering can be orcomprise a metal foil. In this case, the metal foil can, for example,contain copper or consist of copper.

The covering can completely cover a region covered by it. Alternativelythereto, it can be provided that the covering has at least one aperture.The at least one aperture can leave open a subregion in the regioncovered by the covering, which subregion is not covered by the covering.The non-covered region or the non-covered regions can lie at leastpartly in the region of the component. In other words, surface regionsof the component can be left open by the covering. The at least oneaperture can be configured in the shape of an oval (e.g. a circle) or apolygon (e.g. a square).

If the covering has a plurality of apertures, it can be provided thatthe covering comprises webs lying between the apertures. The aperturescan be arranged, for example, on a single line or on lines runningsubstantially parallel to one another (e.g. in the manner of a matrix).

The plane in which the frame top side lies can be substantiallyidentical to a plane in which the component top side lies. In this case,the covering attached at least to the portion of the top side of thecomponent and at least to the portion of the frame can extendsubstantially in one plane.

The component top side can also be arranged with a certain (e.g.tolerance-related or intentional) height offset parallel to the frametop side. The covering can bridge the height offset between the top sideof the component and the top side of the frame. In this case, it can beprovided that the covering bridges a height offset between approximately0 μm and 500 μm. It can, for example, also be provided that the coveringbridges a height offset up to 150 μm or up to 300 μm. The height offsetcan be caused by a projection of the component beyond the frame—or viceversa.

The covering can be attached without a gap to the at least one portionof the top side of the component. At least in this case the attachmentof the covering to the top side of the component can be effected bymeans of an adhesive. The adhesive can be an electrically and/or athermally conductive adhesive. Additionally or alternatively thereto,the covering can be attached by means of an (at least electricallyconductive) adhesive to the at least one portion of the frame.

An adhesive layer thickness extending between the component top side andthe covering can correspond to or be different from an adhesive layerthickness extending between the frame top side and the covering. Theadhesive layer thickness can assume generally values between 2 μm and150 μm, in particular between approximately 10 μm and 75 μm.

It can be provided that the covering covers substantially the entire topside of the component. At least in this case, it can be provided thatthe covering is also thermally conductively formed. The covering canfurther be attached substantially to the entire top side of thecomponent. For dissipation of a heat emanating from the component viathe covering, the attachment of the covering to the top side of thecomponent can be effected by means of a thermally conductive adhesive ora thermally and electrically conductive adhesive.

Alternatively thereto, it can be provided that the covering does notcover a region of the top side of the component which is spaced from aborder of the component top side. In this case, the top side of thecomponent, at least in the portion to which the covering is notattached, can be electrically conductively formed and be in electricalcontact with the covering. Furthermore, the covering can be attached bymeans of an electrically conductive adhesive or an electrically andthermally conductive adhesive to the top side of the component. Theelectromagnetic shielding of the electronic component can, in this case,at least be assisted by virtue of the electrical contact between theelectrically conductive component top side and the covering and alsobetween the covering and the frame.

Furthermore, the covering can cover substantially the entire top side ofthe frame. A region of the frame top side which is not covered by thecovering can run, for example, along an outer border of the frame topside. The region of the frame top side which is not covered by thecovering can in this case comprise, for example, between ⅓ and ⅕ of aframe width extending starting from the outer border to the inner borderof the frame top side.

The top side of the frame can be formed by edges, facing away from thesubstrate, of side faces of the frame. The top side of the frame canalso be configured as a flange extending from the side faces of theframe inwards. The flange can in this case extend substantiallyperpendicularly to the frame side faces. The flange can be produced byfolding at the transition to the side faces.

It can be provided that the arrangement comprises a lid arranged on theframe. The lid can have an opening at least in the region of thecomponent. The lid can further have side faces which lie against sidefaces of the frame. The side faces of the lid can lie at least againsthalf of the frame side faces extending downwards starting from the frametop side.

Border regions of the lid can be arranged between the frame and the lid.It can be provided that the covering is electrically conductivelyattached to the frame by means of clamping between the lid and the atleast one portion of the frame. The attachment of the covering by meansof clamping can be effected additionally or alternatively to attachmentby means of the adhesive.

The arrangement can further comprise a heat sink which is arranged abovethe component. The heat sink can be in thermal contact with thecomponent. To provide the thermal contact, a heat-conducting mediumhaving thermally conductive properties (e.g. a heat-conducting paste)can be arranged between the component and the heat sink. In this case,the heat-conducting medium can be arranged directly on the region of thecomponent top side which is not covered by the covering or on thecovering which covers substantially the entire component top side.

According to a second aspect, a method for electromagnetic shielding ofan electronic component attached to a substrate is provided. The methodcomprises the step of attaching an electrically conductive frame and thecomponent to the substrate in such a way that the frame frames thecomponent. The method further comprises the step of attaching anelectrically conductive covering at least to a portion of a top side ofthe component and of attaching the electrically conductive covering atleast to a portion of the frame in such a way that the covering is inelectrical contact with the portion of the frame.

The attaching of the component and/or of the frame can comprise carryingout a reflow process. In this case, solder balls can be attached to abottom side of the component and/or to a bottom edge of the side facesof the frame, which melt during the reflow process. By carrying out thereflow process, heights, starting from the substrate, of the componenttop side and also of the frame top side can be reduced in ways differentfrom one another and thus result in a height offset.

The method can further comprise the step of attaching a lid to the frameat least partly covered by the covering. Alternatively or additionallythereto, the method can comprise the step of attaching a heat sink abovethe component at least partly covered by the covering, wherein the heatsink is brought into thermal contact with the component.

It can be provided that the method is carried out at least partly by anequipping robot. Therefore, according to a third aspect a computerprogram product which is stored on a computer-readable storage device isprovided. The computer program product is operable to cause theequipping robot to carry out the method presented here.

BRIEF DESCRIPTION OF THE DRAWINGS

Further advantages, details and features of the solution described herewill become apparent from the following description of exemplaryembodiments and also from the figures, in which:

FIG. 1 shows a schematic representation of an exemplary embodiment of anelectrically conductive frame which is attached to a substrate in such away that the frame frames an electronic component;

FIGS. 2A and 2B show schematic representations of an exemplaryembodiment of an arrangement for electromagnetic shielding of theelectronic component;

FIGS. 3A to 3C show schematic side views of exemplary embodiments of thearrangement according to FIGS. 2A and 2B;

FIGS. 4A and 4B show schematic representations of an alternativeexemplary embodiment of the arrangement according to FIGS. 2A and 2B;

FIGS. 5A to 5C shows schematic representations of an exemplaryembodiment of an alternative arrangement to the arrangement according toFIGS. 2A and 2B for electromagnetic shielding of the electroniccomponent; and

FIG. 6 shows a flow diagram of exemplary embodiments of a method forelectromagnetic shielding of the electronic component.

DETAILED DESCRIPTION

FIG. 1 shows a perspective representation of a component of an exemplaryembodiment of an arrangement for electromagnetic shielding, namely anelectrically conductive frame 10, and also an electronic component 12 tobe shielded. The frame 10 and also the component 12 are attached to atop side of a substrate 14, for example a printed circuit board. Theframe 10 is produced from a metallic material (e.g. sheet steel). Thecomponent 12 can be an integrated circuit which is accommodated in ahousing (e.g. made of a non-conductive material such as plastic).

The arrangement for electromagnetic shielding of the component 12presented here can be part of an electronic control unit (ECU). In thiscase, the component 12 can, for example, be a processor of theelectronic control unit or comprise the processor. Furthermore, thesubstrate 14 can be a printed circuit board. The electronic control unitcan be provided for installation in a motor vehicle.

In the exemplary embodiment, the frame 10 comprises a frame top side 16of flat form, which is arranged parallel to the top side of thesubstrate 14. In the exemplary embodiment shown, an outer border 18 ofthe frame top side 16 is configured in the shape of a rectangle. Aninner border 20 of the frame top side 16 defines an opening of the frame10 which is configured in the shape of a smaller rectangle with bevelledcorners. In an alternative exemplary embodiment, the outer border 18and/or the inner border 20 of the frame 10 can assume shapes differenttherefrom or coincide. The frame 10 further comprises frame side faces22 which, starting from the outer border 18 of the frame top side 16,extend downwards in the direction of the substrate 14.

The frame 10 is attached to the substrate 14 in such a way that theframe 10 frames the component 12. In this case, a plane defined by theframe top side 16 is substantially identical to a plane in which a topside 24, facing away from the substrate 14, of the component 12 lies.Alternatively thereto, the frame top side 16 can be arranged with acertain (e.g. tolerance-related or intentional) height offset parallelto the component top side 24. The frame 10 is laterally separated fromthe component 12 by a gap 28.

In FIGS. 2A and 2B, schematic representations of an exemplary embodimentof an arrangement, designated generally by 30, for electromagneticshielding of the electronic component 12 attached to the substrate 14are shown. These can be the component 12 and the substrate 14 asexplained with reference to FIG. 1. FIGS. 2A and 2B show respectively aperspective exploded view and a perspective view of the arrangement 30from above.

The arrangement 30 comprises the electrically conductive frame 10 (cf.the exemplary embodiment according to FIG. 1), an electricallyconductive covering 32 and a lid 34.

The covering 32 is arranged above the component top side 24 and abovethe top side 16 of the frame 10. In the exemplary embodiment shown inFIGS. 2A and 2B, the covering 32 is configured in such a way that thecovering 32 covers the entire top side 24 of the component 12.Nevertheless, in order to dissipate a heat generated by the component 12via the covering 32 (e.g. to a heat sink), it can be provided that thecovering 32 has thermally conductive properties in addition to theelectrical conductivity. Furthermore, the covering 32 can, at least inthis case, be thermally conductively attached at least to a portion ofthe component top side 24.

In the exemplary embodiment shown in FIGS. 2A and 2B, the covering 32 isfurthermore configured in such a way that the covering 32 coverssubstantially the entire top side 16 of the frame 10. Alternativelythereto, it can be provided that the covering 32 does not cover, forexample, a region running along the outer border 18 of the frame topside 16. The region can comprise, for example, between ⅓ and ⅕ of aframe width extending between the outer border 18 and the inner border20 of the frame top side 16.

The lid 34 comprises a lid top side 36 and lid side faces 38. The lidtop side 36 has an opening. In this case, it can be provided that thelid top side 36 has the opening at least in the region above thecomponent 12 arranged below the lid top side 36. The lid side faces 38,starting from an outer border of the lid top side 36, extend downwardsin the direction of the substrate 14.

As shown in FIG. 2B, the lid 34 is attached (e.g. in a form-fittingmanner) to the frame 10. In this case, the lid top side 36 is arrangedsubstantially parallel to the frame top side 16. Furthermore, the sidefaces 38 of the lid 34 lie against the side faces 22 of the frame 10. Inthe exemplary embodiment shown, the side faces 38 of the lid 34 coversubstantially the entire side faces 22 of the frame 10. Border regionsof the covering 32 are arranged between the top side 16 of the frame 10and the lid 34.

In the exemplary embodiment shown in FIGS. 2A and 2B, theelectromagnetic shielding of the component 12 is achieved by anelectrical contact between the covering 32, covering substantially theentire component top side 24, and the frame 10 framing the component 12.In this case, the covering 32 is electrically conductively attached atleast to a portion of the frame 10 (e.g. clamped by means of the lid 34and/or attached by means of an adhesive).

FIGS. 3A to 3C show schematic side views of exemplary embodiments of thearrangement 30 for electromagnetic shielding of the electronic component12 attached to the substrate 14 according to FIGS. 2A and 2B. Thearrangement 30 shown in FIGS. 3A to 3C comprises the electricallyconductive frame 10 and the electrically conductive covering 32 (cf.exemplary embodiments in FIGS. 2A and 2B).

In the exemplary embodiments shown in FIGS. 3A to 3C, the component 12has, on a bottom side facing the substrate 14, contacts in the form ofsolder balls 40. In this case, the component 12 can comprise a ball gridarray (BGA). In the state of the component 12 when attached to thesubstrate 14, the molten solder balls 40 are connected to contact pads42 of the substrate 14. It can additionally be provided that the frame10 is likewise attached to the substrate 14 by means of molten solderballs 40 (not shown) or otherwise.

The top side 16 of the frame 10 is configured as a flange extendinginwards from the side faces 22 of the frame 10. The flange extends inthis case substantially perpendicularly to the frame side faces 22.

The covering 32 is attached without a gap to the top side 24 of thecomponent 12 and also to the top side 16 of the frame 10. In this case,in the exemplary embodiments shown in FIGS. 3A to 3C, the covering 32 isattached substantially to the entire top side 24 of the component 12 andsubstantially to the entire top side 16 of the frame 10. In analternative exemplary embodiment, it can be provided to attach thecovering 32 only to a portion of the top side 24 of the component 12and/or only to a portion of the top side 16 of the frame 10.

As shown in FIGS. 3A to 3C, the covering 32 is attached to the component12 by means of an adhesive layer 44 applied to the top side 24 of thecomponent 12. The covering 32 is furthermore attached to the frame 10 bymeans of an adhesive layer 46 applied to the frame top side 16. Anadhesive layer thickness extending between the component top side 24 andthe covering 32 corresponds in this case approximately to an adhesivelayer thickness extending between the frame top side 16 and the covering32. Alternatively thereto, the thickness of the adhesive layer 46applied to the frame top side 16 can be different from the adhesivelayer 44 applied to the component top side 24. The adhesive layerthicknesses can assume values between 2 μm and 100 μm, in particularbetween approximately 10 μm and 50 μm. The adhesive layers 44, 46 canthus each have, for example, a thickness of approximately 25 μm.

The adhesive used for the adhesive layers 44, 46 can be in the form ofan adhesive foil. The adhesive can furthermore be electricallyconductive and thermally conductive. The adhesive can, for example, bean ECATT (Electrically Conductive Adhesive Transfer Tape). Alternativelythereto, the attachment of the covering 32 to the top side 16 of theframe 10 can be effected by means of an electrically conductive adhesiveand/or the attachment of the covering 32 to the top side 24 of thecomponent 12 can be effected by means of a thermally conductiveadhesive.

The arrangement 30 shown in FIG. 3A comprises a heat sink 48 which isarranged above the component 12. The heat sink 48 is thermally connectedto the component 12 by means of a heat-conducting medium 50 (e.g. aheat-conducting paste) arranged between the covering 32 and the heatsink 48. The heat-conducting medium 50 is in this case arrangedsubstantially on the entire component top side 24 covered by thecovering 32. Alternatively thereto, the heat-conducting medium can bearranged only on a region of the component top side 16 covered by thecovering 32. In the exemplary embodiment shown in FIG. 3A, the heatgenerated by the component 12 can thus be dissipated to the heat sink 48via the (at least) thermally conductive adhesive layer 44, the thermallyconductively formed covering 32 and the heat-conducting medium 50. In analternative exemplary embodiment, it can, for example, be provided toarrange the heat sink 48 directly (without the heat-conducting medium50) on the covering 32. It should be pointed out that the arrangements30 according to the exemplary embodiments shown in FIGS. 3B and 3C canalso comprise the heat sink 48 and the heat-conducting medium 50.

The arrangement 30 shown in FIG. 3B further comprises the (optional) lid34, as described with reference to FIGS. 2A and 2B. In this case, thelid 34 is attached to the frame 10 in such a way that the border region,arranged between the frame top side 16 and the lid 34, of the covering32 is clamped between the frame 10 and the lid 34. In an alternativeexemplary embodiment to that shown in FIG. 3B, it can therefore beprovided to attach the covering 32 to the frame 10 by means of theclamping, without the adhesive layer 46 applied to the frame top side16.

In the exemplary embodiments according to FIGS. 3A and 3B, the plane inwhich the frame top side 16 lies (represented by the dotted line) issubstantially identical to the plane in which the component top side 24lies. In contrast thereto, the component top side 24 (in the planerepresented by the dashed line) is arranged, in the exemplary embodimentshown in FIG. 3C, with a height offset parallel above the frame top side16 (in the plane represented by the dotted line). Alternatively thereto,the component top side 24 can be arranged with a height offset parallelbelow the frame top side 16.

The covering 32 attached to the frame top side 16 and to the componenttop side 24 bridges in this case the height offset shown in FIG. 3C. Inthis case, it can be provided to configure the covering 32 in such a waythat the covering 32 bridges a height offset between approximately 0 μmand 500 μm. It can also be provided that the covering bridges a heightoffset up to 200 μm or up to 300 μm.

To bridge the height offset, the covering 32 is flexibly formed.Concretely, it is provided that the covering 32 is bendably formed. Theflexibility of the covering 32 can be dependent on a property of thecovering 32, such as, for example, on a material and/or on a thickness.In the exemplary embodiment, the covering 32 comprises a metal foil.This can be a copper foil for example. Alternatively or additionallythereto, the metal foil can comprise other components. It can beprovided that the covering 32 has a thickness of between approximately20 μm and 250 μm. The thickness of the covering 32 can assume, forexample, values between approximately 20 μm and 100 μm (e.g. 70 μm).

In the exemplary embodiments shown in FIGS. 3A to 3C, the covering 32 isattached to the top side 16 of the frame 10. Alternatively oradditionally thereto, it can be provided to attach the covering 32 tothe side faces 22 of the frame 10. In this case, the covering 32 cancomprise a region projecting laterally beyond the frame top side 16. Theregion of the covering 32 projecting laterally beyond the frame top side16 can be attached to the frame 10, for example by means of adhesiveand/or by means of clamping between the frame side faces 22 and the sidefaces 38 of the lid 34 (cf. the exemplary embodiment according to FIG.3B). At least in this case, the top side 16 of the frame 10 can beconfigured as an edge, facing away from the substrate 14, of the sidefaces 22 of the frame 10.

FIGS. 4A and 4B show representations of a further exemplary embodimentof the arrangement 30 for electromagnetic shielding of the electroniccomponent 12 attached to the substrate 14 according to FIGS. 2A to 3C.FIGS. 4A and 4B show respectively a perspective exploded view and aperspective view of the arrangement 30 from above.

In contrast to the covering 32 described with reference to FIGS. 2A to3C, the covering 52 shown in FIGS. 4A and 4B has a plurality ofapertures 54. The top side 24, covered by the covering 52, of thecomponent 12 is not covered by the covering 52 in subregions determinedby the apertures 54.

In the exemplary embodiment shown in FIGS. 4A and 4B, the apertures 54are configured in the shape of circles. Furthermore, the apertures 54are arranged on lines running substantially parallel to one another (inthe manner of a matrix). The regions of the covering 52 which liebetween the apertures 54 are configured as webs. A relationship betweena distance between centres of two adjacent apertures 54 and a diameterof an aperture 54 can in this case assume, for example, values between1.5 and 5.0 (e.g. 3.0). In another exemplary embodiment, the apertures54 can be configured in the shape of another oval or a polygon (e.g. asquare). Furthermore, the number of apertures 54 and/or theirarrangement can vary. The apertures 54 can determine a non-covered(left-open) subregion, of which the area proportion of a surface of thecovering 52 assumes, for example, between 10% and 60% (e.g. 20%). Acentre line running through the subregions can have, for example,lengths between 0.5 mm and 5 mm (e.g. 3 mm).

In FIG. 4A, an adhesive layer 56 comprised by the arrangement 30 andconfigured as adhesive foil (tape) is shown. The adhesive layer 56 isconfigured for gap-free attachment of the covering 52 to the top side 24of the component 12 and to the top side 16 of the frame 10. The adhesivelayer 56 likewise has apertures 58. In other exemplary embodiments, theadhesive layer can be one of the adhesive layers 44, 46, as describedwith reference to FIGS. 3A to 3C.

In the exemplary embodiment shown in FIGS. 4A and 4B, the apertures 58of the adhesive layer 56 are configured and arranged in such a way that,on attachment of the adhesive layer 56 and of the covering 52 to thecomponent 12, they coincide with the apertures 54 of the covering 52. Inanother exemplary embodiment, the apertures 58 of the adhesive layer 56can be formed differently from the apertures 54 of the covering 52and/or arranged differently thereto. Thus, for example, it can beprovided that the apertures 58 of the adhesive layer 56 have a larger orsmaller circumference than the apertures 54 of the covering 52.

The apertures 54 of the covering 52 and apertures 58 of the adhesivelayer 56 which are shown in FIGS. 4A and 4B enable gases or gas mixtures(e.g. air) to escape during the attachment of the covering 52. Aninclusion of the gases or gas mixtures which increases the thermalresistance of the arrangement can thus be reduced or completelyprevented.

FIGS. 5A to 5C show schematic representations of an exemplary embodimentof an arrangement, designated generally by 60, for electromagneticshielding of the electronic component 12 attached to the substrate 14(cf. the exemplary embodiments according to FIGS. 1 to 4B). In thiscase, FIGS. 5A, 5B and 5C show respectively a perspective exploded viewfrom above, a perspective view from above and a side view of thearrangement 60.

The arrangement 60 shown in FIGS. 5A to 5C comprises the electricallyconductive frame 10 and an electrically conductive covering 62. It canbe the frame 10 according to the exemplary embodiments shown in FIGS. 1to 4B.

In contrast to the coverings 32, 52 described with reference to FIGS. 2Ato 4B, the covering 62 shown in FIGS. 5A to 5C has an opening 64. Theopening 64 is configured in such a way that the covering 62, in thestate when attached to the component 12 and to the frame 10, does notcover, i.e. leaves open, a region of the component top side 24. In theexemplary embodiment shown in FIGS. 5A to 5C, the covering 62 coversonly an outer border region of the component top side 24. It can beprovided that the covering 62 covers, for example, between ⅓ and ⅕ ofthe component top side 24 in the outer border region thereof.

In the exemplary embodiment shown in FIGS. 5A to 5C, the component 12has an electrically conductively formed top side 24 (e.g. in the form ofa metallic coating). For electromagnetic shielding of the component 12,the covering 62 is in electrical contact with the component top side 24.For this purpose, the covering 62 is attached without a gap (e.g. bymeans of an electrically conductive adhesive) at least to a portion inthe outer border region of the component top side 24. In anotherexemplary embodiment, it can be provided that the top side 24 of thecomponent 12 is electrically conductively formed and in electricalcontact with the covering 62 only in a region to which the covering 62is not attached.

It can further be provided that the opening 64 of the exemplaryembodiment shown in FIGS. 5A to 5C is replaced by apertures 54 and websrunning between the apertures 54, as described with reference to FIGS.4A to 4C. In this case, a centre line running respectively through thesubregions can have, for example, lengths between 0.5 mm and 10 mm (e.g.3 mm).

The arrangement 60 shown in FIGS. 5A and 5B further comprises the lid 34as an option. This can be the lid 34 explained with reference to FIGS.2A, 2B and 3B. It can be provided to attach the covering 62 to the frame10 (e.g. additionally or alternatively to the adhesive) by means ofclamping between the frame 10 and the lid 34.

As shown in FIG. 5C, the arrangement 60 can further comprise the heatsink 48 and the heat-conducting medium 50 (cf. the exemplary embodimentsaccording to FIGS. 3A to 3C). In contrast to the exemplary embodimentshown in FIG. 3A, the heat-conducting medium 50 is arranged, in theregion of the component top side 24 not covered by the covering 62,directly on the component top side 24.

FIG. 6 shows a flow diagram of exemplary embodiments of a method forelectromagnetic shielding of the electronic component 12 attached to thesubstrate 14, according to FIGS. 1 to 5C. The method can be provided forbeing carried out by an equipping robot.

In a first method step 70 the component 12 is attached to the substrate14. In a second method step 72 the frame 10 (cf. the exemplaryembodiments according to FIGS. 1 to 5C) of the arrangement 30, 60 forelectromagnetic shielding explained with reference to the FIGS. 2A to 5Cis attached to the substrate 14 in such a way that the frame 10 framesthe component 12. Alternatively thereto, it can be provided to carry outthe method steps 70 and 72 differently from the order described (e.g.simultaneously).

At least the component 12 can be attached to the substrate 14 by meansof a reflow process (step 70). In this case, the solder balls 40attached to the bottom side of the component 12 can (after arranging thecomponent 12 on the substrate 14) be melted (cf. the exemplaryembodiments in FIGS. 3A to 3C and 5C). The attachment of the frame 10(step 72) to the substrate 14 can be effected in the same way by meansof the reflow process or differently therefrom (e.g. by means ofthrough-hole technology).

Owing to the melting of the solder balls 40, a height, starting from thesubstrate 14, of a top side of a component attached by means of thereflow process can be reduced. Thus, the heights of the component topside 24 and of the frame top side 16 described with reference to FIGS.2A to 5C can be reduced in ways different from one another. A heightoffset, present before carrying out the reflow process, between thecomponent top side 24 and the frame top side 16 can be reduced orincreased (e.g. due to tolerance).

In a further method step 74 the electrically conductive covering 32, 52,62 (cf. the exemplary embodiments in FIGS. 2A to 5C) is attached atleast to a portion of the top side 24 of the component 12. Furthermore,in a method step 76 the electrically conductive covering 32, 52, 62 isattached at least to a portion of the frame 10 in such a way that thecovering 32, 52, 62 is in electrical contact with the frame 10. Theattaching of the covering 32, 52, 62 to the component top side 24 (step74) and the attaching of the covering 32, 52, 62 to the frame 10 (step76) can also be effected in the order described or differently therefrom(e.g. simultaneously). As explained with reference to FIGS. 3A to 3C,the covering 32, 52, 62 bridges the height offset, present after theattaching of the component 12 (step 70) and after the attaching of theframe 10 (step 72) to the substrate 14, between the component top side24 and the frame top side 16.

By attaching the covering 32, 52, 62 in the steps 74 and 76, theelectromagnetic shielding of the component 12 is completed. Theelectromagnetic shielding results from the electrical contact betweenthe covering 32, 52, covering substantially the entire component topside 24, and the frame 10 (cf. the exemplary embodiments according toFIGS. 2A to 4B). Alternatively thereto, the electromagnetic shieldingcan result by means of the electrical contact between the electricallyconductive component top side 24 and the covering 62 and also betweenthe covering 62 and the frame 10 (cf. the exemplary embodimentsaccording to FIGS. 5A and 5C).

In a further method step 78 the lid 34 described with reference to FIGS.2A to 5C is attached to the frame 10 covered at least partly by thecovering 32, 52, 62. The attaching of the lid 34 to the frame 10 (step78) can correspond to the attaching of the covering 32, 52, 62 to theframe 10 (step 76). In this case, the covering 32, 52, 62 can beattached by means of clamping between the frame 10 and the lid 34, asexplained with reference to the exemplary embodiments shown in FIGS. 3Ato 3C. Alternatively thereto, it can be provided that the attaching ofthe lid 34 to the frame 10 (step 78) can be effected additionally to theattaching of the covering 32, 52, 62 (e.g. by means of adhesive) to theframe 10 (step 78) or that the attaching of the lid 34 (step 70) isdispensed with.

Finally, in a last method step 80 the heat sink 48 described withreference to FIGS. 3A and 3C can be attached above the component 12covered at least partly by the covering 32, 52, 62. In this case, theheat sink 48 is brought into thermal contact with the component 12 (e.g.by means of the heat-conducting medium 50).

With reference to the preceding exemplary embodiments, the component 12and also the arrangement 30, 60 for electromagnetic shielding can beattached to the substrate 14, with no gap having to be tolerated in thecase of a height difference between the top side 16 of the frame 10above the top side 24 of the component 12. Thus, an electromagneticshielding of the component 12 and also a thermal dissipation of the heatproduced by the component 12 can be achieved and at the same time theoverall height of the arrangement 30, 60 can be minimised.

The exemplary embodiments described provide various features and uses ofa solution regarding an arrangement and a method for electromagneticshielding. In a different exemplary embodiment these features can, ofcourse, also be combined as desired.

1. An arrangement for electromagnetic shielding of an electroniccomponent attached to a substrate, comprising: an electricallyconductive frame which is attached to the substrate in such a way thatthe frame frames the component; and an electrically conductive coveringwhich is attached at least to a portion of a top side of the component;and which is electrically conductively attached at least to a portion ofthe frame.
 2. The arrangement according to claim 1, wherein the coveringis flexibly formed.
 3. The arrangement according to claim 1, wherein thecovering has a thickness of at most 250 μm.
 4. The arrangement accordingto claim 1, wherein the covering is or comprises a metal foil.
 5. Thearrangement according to claim 1, wherein the covering is configured tobridge a height offset between the top side of the component and a topside of the frame.
 6. The arrangement according to claim 5, wherein thecovering bridges a height offset between 0 μm and 500 μm.
 7. Thearrangement according to claim 1, wherein the covering is attachedwithout a gap to the top side of the component.
 8. The arrangementaccording to claim 1, wherein the covering is attached by means of anadhesive to the top side of the component and/or to the frame.
 9. Thearrangement according to claim 1, wherein the covering has at least oneaperture.
 10. The arrangement according to claim 1, wherein the coveringcovers substantially the entire top side of the component.
 11. Thearrangement according to claim 10, wherein the covering is attachedsubstantially to the entire top side of the component.
 12. Thearrangement according to claim 10, wherein the covering is attached bymeans of a thermally conductive adhesive or a thermally and electricallyconductive adhesive to the top side of the component.
 13. Thearrangement according to claim 1, wherein the covering does not cover aregion of the top side of the component which is spaced from a border ofthe top side of the component.
 14. The arrangement according to claim13, wherein the top side of the component, at least in the portion towhich the covering is not attached, is electrically conductively formedand is in electrical contact with the covering.
 15. The arrangementaccording to claim 13, wherein the covering is attached by means of anelectrically conductive adhesive or an electrically and thermallyconductive adhesive to the top side of the component.
 16. Thearrangement according to claim 1, wherein the top side of the frame isconfigured as a flange extending from side faces of the frame inwards.17. The arrangement according to claim 1, further comprising a lidarranged on the frame, wherein border portions of the covering arearranged between the frame and the lid.
 18. The arrangement according toclaim 17, wherein the lid has an opening at least in the region of thecomponent.
 19. The arrangement according to claim 17, wherein the lidhas side faces which lie against side faces of the frame.
 20. Thearrangement according to claim 17, wherein the covering is electricallyconductively attached to the frame by means of clamping between the lidand the at least one portion of the frame.
 21. The arrangement accordingto claim 1, further comprising a heat sink which is arranged above thecomponent and is in thermal contact with the component.
 22. A method forelectromagnetic shielding of an electronic component attached to asubstrate, comprising the steps: attaching an electrically conductiveframe and the component to the substrate in such a way that the frameframes the component; attaching an electrically conductive covering atleast to a portion of a top side of the component; and attaching theelectrically conductive covering at least to a portion of the frame insuch a way that the covering is in electrical contact with the portionof the frame.
 23. The method according to claim 22, wherein theattaching of the component and/or of the frame comprises carrying out areflow process.
 24. The method according to claim 22, further comprisingthe step of attaching a lid to the frame at least partly covered by thecovering.
 25. The method according to claim 22, further comprising thestep of attaching a heat sink above the component, wherein the heat sinkis brought into thermal contact with the component.
 26. A computerprogram product which is stored on a computer-readable storage medium,operable to cause an equipping robot to carry out the method accordingto claim 22.